Xinyue Chemical Will Manufacture New Equipment In 2028 Production Packaging Substrate Manufacturing

Recently, Japanese semiconductor materials supply Shangxin Yue Chemical announced, it is planned to be planned2028Formally mass production of its latest packaging substrate manufacturing equipment.It is understood that this device can simplify the process of connecting the semiconductor chip to the substrate in the process to eliminate the rightChiplet(Core grain) The demand of the intermediary layer, the initial investment of the substrate manufacturing will be reduced by more than half, thereby improving the production efficiency andquality.

The packaging substrate is an indispensable part of semiconductor devices. It not only provides physical support for the chip, but also assumes the key role of electrical signal transmission and heat distribution.along with5G, The rapid development of artificial intelligence, the Internet of Things and other technologies, the market's demand for high -performance packaging substrates is increasingly urgent.

It is reported that this new semiconductor packaging substrate manufacturing equipment developed by Xinyue Chemical Development will no longer use photoresist equipment to form a traditional method of wiring. Instead, it uses a new system that uses lasers to etch on the substrate.The molecular laser machining system, by applying the dual inlaid method used in the front semiconductor process in the production substrate production of the rear section process, can directly integrate the function of the intermediary layer to the packaging substrate, eliminating the demand for the intermediary layer, but also achieved it.Millet processing.

The intermediary layer is a high -performance substrate, which is located in eachChipletBetween the interconnection of these small chips to achieve high -speed data transmission and communication.WithChipletThe continuous development of technology, the design and manufacturing of the intermediary layer have become more and more complicated, and it has become a problem that semiconductor manufacturers need to break through.

Xintye Chemical eliminates the demand for the intermediary layer through dual inlaid methods, thereby shortening the advanced semiconductor manufacturing process cycle and reducing costs.Xinyue Chemical stated that it is planned to invest in the next four years100100 million yen is used for the research and development and production line construction of new equipment. It is expected that the new equipment will be in2028Realize commercial production annually, and gradually expand production capacity to meet market demand.