existintegrated circuitIn the process,Full-MASK is a key concept that involves the use of models in the process of semiconductor manufacturing.Covering the template is an optical tool for the pattern of the surface of th...

From a technical point of view,Pilot Run refers to a series of small -scale production operations carried out before the development of new process platforms or new products, which is used to verify and optimize process...

Future semiconductorOn the 9th, according to the survey, Jiang Bolongzis company Yuancheng Suzhou has the mass production capacity of the wafer high -stack package (part of HBM technology).Yuancheng Technology (Suzhou) C...

Season 2 ChinaThe arrival of the consumer season in the middle of 618 and the consumer terminal inventory have returned to the health level. Customers have successively launched consumer parts to be stored or replenished...

Intel is one of the most difficult times in history.To cope with this challenge,CEO Pat Kissinger and his executive team plan to submit a comprehensive re -planning plan at the board meeting in mid -September.The plan is...

In the past impression, the wafer was round and the chip was square.Why is it called a wafer?Not called Jingfang?Why is the wafer round and the chip is square?How to calculate the size of the wafer?NymphoYesterday, Ningb...

In the field of domestic semiconductor high -end testing equipment, Suzhou Silicon Semiconductor Technology Co., Ltd. (hereinafter referred to as Silicon Semiconductor) came again.Recently, the company announced that its...

according toKnometa Research of2024 Report on the Global Words of the Year report, estimated 2024 The capacity expansion of the year wafer plant will be relatively low, only 4%Because the manufacturer allows the capacity...

TECHCET Previous forecast 2024 The sales of silicon wafers will grow 6%But now facing growth barriers.　　TECHCET Executive Officer and President Lita Shon-Roy Represents: 9 The excess silicon wafer inventory held by the m...

7月11日消息，据媒体报道，英特尔在德国马格德堡投资300亿欧元(约合2364亿元人民币)的晶圆厂建设项目目前陷入困境。原计划于2023年下半年开工的Fab 29.1和Fab 29.2两座工厂，因多重因素影响，开工时间将继续延后，这也意味着量产时间可能推迟至2030年。这个投资项目曾被视为英特尔在全球半导体产业布局的重要一步，德国联邦政府原计划提供100亿欧元补贴，以支持该项目。此前由于欧盟补贴的确认延迟，以及建厂地区需要移除的黑土问题...