Wafer Level Optical Chip Company "kun Tour Photoelectric" Completes A New Round Of Financing.

Investment industry (WeChat ID:pedaily2012) May 7th news, focused on the wafer level optical chip company Kun tour optoelectronic announced the completion of the A2 round of financing, the current round by the yuan capital, warden international and the Chinese Academy of Sciences under the foundation of the fund co investment. Kun Yu has been awarded several rounds of financing such as Shun Yu optics, Kun Chung capital, Chen Hui venture capital and China Star.

Kun you optoelectronic, founded in 2016, is a high-tech enterprise focusing on the development and application of wafer level optical chips. It is committed to exploring the integration of semiconductor technology and optical technology. It is designed and made into nanoscale and low cost optical chips by semiconductor wafer.

It is understood that Kun tour optoelectronic has complete design, plate making, scale production and close loop detection. The hot 3D imaging in the current market will play an important role in the fields of unmanned driving, AR/MR display, 5G optical communication link, medical image, aviation military industry and automatic security and so on.

On the team side, Kun travel photoelectric core R & D team and management layer from Stanford University, University of Rochester, University of Cambridge, Zhejiang University and other photoelectricity institutes, Ph. D., former Microsoft, NASA, Fortis fiber, RAPOO, McKinsey and other executives.

At present, the Kun tour optoelectronic I production line will be completed in May this year, when the diffraction optical chip DOE of scale production, optical field display optical waveguide, high-speed optical communication link and other wafer level optical chips will be realized. As a very cross cutting frontier, through this round of financing, the company has constructed a perfect organization network of optical, semiconductor, Chinese Academy of Sciences, well-known venture capital fund and so on, and the coordination layout is gradually improved.

Liu Yiran, a capital partner and Ph. D. of optoelectronics, believes that the wafer level of the optical chip has been made from the wafer level to the consumer domain, which will lead to the demand for a series of incremental scenes in the short to long term. It is foreseeable that in the next three years, the consumption level application of machine vision, represented by the three requirements of deep sensing, AR and pilotless, will be the first to develop. In the medium and long term, the photon will gradually penetrate into the operation link and lead to more profound changes in the application of machine intelligence.

Wang Lin, a Walden International partner and years of semiconductor experience, said that with Moore's law to the limit, the development of semiconductor integrated circuits is drawing a perfect "S curve" to approach the ceiling. "Integrated light" instead of "integrated power" will be an irreversible change. Tracing back to the development of semiconductor chips, nano scale and low cost are two major characteristics of integrated circuit technology. Similarly, wafer level optics makes optics can reduce the cost by an order of magnitude at an order of magnitude, making the commercial value of the optical chip possible.