TI's New Magnetic Packaging Technology Is Expected To Reshape The Power Module Industry Pattern

The demand for electricity in all walks of life is growing. How to develop power levels,EMI, Conversion efficiency, noise, accuracy, isolation, and costs that meet system design requirements, bringing a lot of challenges to power design engineers.

Taking the server as an example, the size of the cabinet loaded in the server in the current machine room is unchanged, but asAIThe gradual advancement of emerging technologies such as the Internet of Things, the amount of data that a single server unit needs to process is several times the amount of data in the past, which means that the corresponding server unit's demand for electricity has also been several times in the past.High -power density power products?

The current most effective solution is to use the latest power management chip, plus advanced module packaging technology to help engineers improvePower conversion efficiency, improve the density of power supply process, and reduce the cost of overall solutions.

recently,TIThe new magnetic packaging technology of its proprietary power module was launchedMagPackAnd simultaneously released six new power module products using this packaging technology.in,TPSM82866A、TPSM82866C and TPSM82816These three products are super small 6A electricitySource module can provide per square millimeter 1A The current output ability.

The specific situation of these six products is displayed in the figure below, such asTPSM82866AandTPSM82866CThe main difference between the between the former is that the former uses wrongI²CInterface, and the latter adoptedI²Cinterface.

picture | Six new power modules with magnetic packaging technology, source:TI

Yao Yunruo, Manager of the product line of the Texas Instrument Returning -the Product Line of the pressure switch, said: In addition to the powerful current output capability, compared with the previous generation of products, it is equipped withTIPower products with new magnetic packaging technology, the size of its power solution can be reduced50%, The average power conversion efficiency of the power module has also improved2%, Module heat dissipation is guaranteed.ForTPSM82816In terms of efficiency performance, it is more prominent, which is higher than the previous generation of products4%The heat resistance is reduced17%, The safe work temperature range has improved10Degree, this is a very big leap.

picture | New method of improving the power module:MagPackIntegrated magnetic packaging technology, source:TI

What isMagPackWhat about integration magnetic packaging technology?It is by Texas Instrument Kilby Labs R & D experts have been launched first, adoptingTIUnique3DPackaging molding process, at the same time, a packaging technology made of integrated electrical sensor made of proprietary new design materials can be greatly reduced to reduce the height, width and depth, and to better transmit heat from the chip to the chip toPCBplate.

At the same time, by adopting this type of power module, engineers can more easily obtain high power density, low temperature, low temperature, low temperature, low temperatureEMIFire system design with radiation and high conversion efficiency.

In this regard, Yao Yunruo revealed:MagPackThe technology is the use of full shielded magnetic packaging technology, which will effectively reduce the radiation level of the power module.EMIValue can be reduced8dB。

picture | TPSM81033EVM-035Evaluation board

It is worth mentioning that the first time it is adoptedMagPackThese six power products of technology will be mainly used in the industrial field. At present, pre -production has been supported. TI.com Buy; at the same time, in order to quickly import the market,TIThere are also four evaluation boards,TPSM81033EVM-035、TPSM82866AA0PEVM、TPSM82866CA3PEVMandTPSM828303PEVM-058。

future,MagPackTechnology will also be used in products such as isolation power supply to be richTIDiversity of product spectrum.