Institution: It Is Expected That The Capacity Expansion Of The Wafer Plant In 2024 Will Be Relatively Low, Only 4%

according toKnometa Research of"2024 Report on the Global Words of the Year "report, estimated 2024 The capacity expansion of the year wafer plant will be relatively low, only 4%Because the manufacturer allows the capacity utilization rate from 2023 The year's low level is restored.

Many originally scheduled 2024 The wafer factory that starts to operate in the year 2022 Construction began in the year, but due to the sluggish market at the beginning of the year, the start date of some wafer factories was postponed 2025 In the year, it was the same as many other wafers originally scheduled to be put into production.

Predict 2025 The current power generation capacity will reach a record level.

The report shows that it is expected2025Annual2310Tens of thousands of pieces200Millimeter equivalent wafer/The annual production capacity is put into production, exceeding2021Year1850The previous level of tens of thousands of wafers.

by300Millimeter wafer equivalent representation,2025Every year, there will be1030The capacity of 10,000 wafers is online.From the perspective of growth rate, and2024Compared with the level of annual production capacity, this number has increased8%。

Predict 2025 Annual 17 New IC The production line is put into operation.This includes:

　　HH Grace - Chinese Wuxi - 300 Millimeter wafer foundry service

Intel - New Orbani, Ohio, USA - Used for logic and foundry 300 Millimeter wafer

　　JS Foundry - Xiaqiangu City, Niigata Prefecture, Japan - 200 Millimeter IC(And separate devices) wafer wafers

　　Kioxia - Nobuki, Iwate Prefecture, Japan - For 3D NAND of 300 Millimeter wafer

　　Micron - Boisi, Aida, USA - DRAM 300 Millimeter wafer

　　PXWelectronic - Shenzhen, China - 300mm Wafer foundry

Samsung - Hirakawa, South Korea (P4 Wallin factory)- For 3D NAND and DRAM of 300 Millimeter wafer

　　SK Hynix - Dalian, China(Fab 68 Expansion)- For 3D NAND of 300 Millimeter wafer

SMIC - Shanghai, China (SN2 Wafers) - 300 Millimeter wafer foundry

　　TI - Sherman, Texas, American - Used for simulation and mixed signals 300 Millimeter wafer

TSMC - Taiwan, China (China, China (ChinaFab 18, The first 8 stage) - 300 Millimeter wafer foundry

　　UMC - Singapore (Fab 12i, The first 3 stage) - 300 Millimeter wafer foundry

Jibang: US wafer fab will rise

　　TrendForceStudies show that2024In the year, Taiwan, China is expected to be expected66%The market share leads the global advanced process (including16/14nmAnd more advanced technology) semiconductor foundry production capacity, followed by South Korea (11%),USA(10%) And China (9%To.However,2027In the year, the production capacity of advanced nodes in Taiwan and South Korea is expected to drop to each other55%and8%。

It is worth noting that although TSMC,SKHerbal and Samsung and other semiconductor giants have continuously increased their investment. However, as the two regions of advanced process market share, market share in Taiwan and South Korea is expected to decline.

On the other hand, in the United States that has vigorously promoted the incentives and subsidy policies in the government, the global production capacity of its advanced manufacturing process is expected to follow 2024 Year 10% Rising 2027 Year 22%。

From the perspective of the overall wafer foundry capacity, it is expected to 2024 In the year, Taiwan, China, will occupy the Global Treaty 44% Market share, followed by mainland China (28%),South Korea (12%),USA (6%) Japan (2%)EssenceThe overall trend is expected to be consistent with advanced nodes.In contrast, it is expected 2027 In the year, the overall semiconductor capacity of Taiwan and South Korea will drop to each other 40% and 10%。

The wafer factories in mainland China pay more attention to expanding the production capacity of mature crafts, and have the support of government subsidies.The performance in the body market is relatively strong, from 2024 Year 28% increase to 2027 Year 31%EssenceIts mature process (including ≥ ≥ ≥28nm Node) capacityThe market share is expected to be from 2024 Year 33% up to 2027 Year 45%。

According to the Korean Daily5moon10Daily report, according to the US Semiconductor Industry Association (SIA) And Boston Consulting Group (BCG)Prediction,2022Taiwan and South Korea in the year10The share in the production of below the semiconductor below the nanometer is69%and31%, And here2032In the year, the market share of the two countries on advanced nodes may fall to47%and9％。

It is reported that the share of South Korean semiconductor production has declined significantly due to Samsung Electronics andSKMaolis and other major manufacturers, they are currently dominated by the global advanced semiconductor market with TSMC.However, they did not invest in South Korea, but chose a factory established in the United States.

American government4Earlier month announced that it will provide Samsung with Gundam64The subsidy of 100 million US dollars is used to expand the advanced chip capacity of its Texas plant.also,SKHylos plans to spend38.7The USD dollar was constructed in Indiana's advanced packaging factory and artificial intelligence product research center.