Home > Industry Information > The Dispute Between HBM Chips Is Intensified
Korean chip manufacturerSKHynix (SK Hynix Inc.)Like the global peers, basically internal design and production semiconductors, including high -capacity memory (HBM)Different fromAIChip, its demand is growing.
However, for the next generationAIchipHBM4The company plans to outsourcing chip manufacturing to foundry or contract chip manufacturers. It is possible that Taiwan Semiconductor Manufacturing Co., Ltd. (TSMC)。
Furthermore, this Korean chip manufacturer is actively looking for talents to promote their own HBM Technical mergers and acquisitions outsourcing.Who is the company's main headhunting goal?Its competitors in the same city, Samsung Electronic Company.
SKHylos is the world's second largest chip manufacturer from the industry's head of Samsung. Among the important recruitment information released by the industry48One and HBM Related positions have experience.
SK In the recruitment, the company is looking for ownership 4 The chip of more than the work experience of the year, improves the foundry technology and test logic chips to improve HBM The yield of logical chip.
Recruitment said that the required capabilities include thorough analysis of foundry technology and development of foundry equipment.
The company especially wants to recruit 9 name FinFET Chip engineer of foundry technology,FinFET It is a technology that can improve semiconductor power efficiency.Interested parties must own 10 Work experience above the year.
Industry observers said,SK Harbin's recruitment plan has aroused concerns about competitors' loss of talents because they are difficult to retain them.
Although Samsung is a global memory chip manufacturer, it is HBM The field is far behindSKHynix.
Samsung vowed this year HBMThe yield is increased by three times, and the designer is eager to pass through the artificial intelligence chipNvidia Corp. High -quality test.
People in the industry said,SKHylos needs to use engineers to develop the sixth generationHBM4, June is planned to start production next year, and it is recommended to develop and improve the next generation3D DRAMChip and memory processing (PIM)chip.
This year4moon,SKIndicates that it is cooperating with TSMC to develop the next generationAIchip.SKHynix dominates the generation formulaAICalculatingHBMProduction, and the advanced packaging technology of this Taiwan wafer agency can helpHBMChip and graphic processing unit (GPU) High -efficiency work.SKHylos said that the two companies will first improve alongHBMEncapsulationperformance.HBMBy using a silicon -pass hole (TSV) Machining technology will be core DRAM The chip stack is made on the top of the substrate.The substrate is connected to the control HBM Chip GPU。SKHynix said it has used consumption technology to create the fourth generation DRAM Memory HBM3E The substrate, but the plan is in HBM4 The substrate uses the advanced logic process of TSMC, and introduces more functions in limited spaces.
Two companies have saved cooperation optimization SK Hynix HBM TSMC 2.5D Packaging process (referred to as CoWoS Integration of technology, cooperative response and response at the same time HBM Related common customer requests.
SamsungThe newly establishedHBMThe team has increased300Famous engineer to developHBM4chip.As the world's second largest wafer foundry in the world second only to TSMC, Samsung can deal withHBM4All related processes, including logical chip design, packaging and production.Samsung Vice Chairman Quan Yongyi Yu Yu5Moon in charge of Samsung Device Solution (DS) The department, the department is responsible for regulating the company's chip business, he vowed to surpassHBMfieldSKHynix.
An industry official said: Samsung HeheSKHylosAIThe competition of the chip domineering status is heating up, the first thoughtHBM4In terms of chip.The first challenge of the Samsung people is to give up Nvidia Approve HBM chip.
Industry Information
