MOLEX Mo Shi's 2025 Predicting High -Speed Connection Technology Will Achieve Continuous And Stable Growth, And Accelerate The Innovation Process Of Electronic Design In Various Industries

Molex Mo Shi Company predicts that in the next 12 to 18 months, with the generation of artificial intelligence (AI), machine learning (ML), and cloud solutions in the fields of data centers, automobiles, consumer electronics and medical technologyInfluence, the market's demand for reliable, durable and high -speed connectors will increase significantly.At the same time, in order to cope with the growing needs of innovation, including the urgent needs of important areas such as heat management, power management, material science and battery technology, the collaboration between electronic product designers, manufacturing engineers and supply chain experts must be strengthened.It is particularly important.

MILEX Molex Mike Deppe, Vice President of Global Product Development, said: It is expected that by 2025, the number of connector -related solutions will continue to increase, helping to define the development of large -scale data centers and software.High -performance connection bottleneck.With the continuous rise in the needs of data and instant information access, connecting technology areas will usher in more opportunities and challenges.We have prepared to represent these challenges on behalf of global customers, suppliers and technical partners.

Top 10 forecasts in 2025

1.         ultra -large -scale data center continues to use high -speed optical transceivers

With the rapid popularization of genetic AI, operators urgently need to improve the data processing capacity and expand capacity of oversized data centers.To this end, they are accelerating the deployment of high -speed optical transceivers to achieve efficient connections inside and outside the rack, thereby increasing port density, enhancing signal integrity, and reducing power consumption.

2.         With the sharp increase in the 224 GBPS PAM-4 connector, thermal management technology needs to be improved urgent to improve

With the increasing deployment of the 224 GBPS PAM-4 connector and the development of the industry's 448 GBPS PAM-4 technology, the solution of the air-cooled data center solution has obviously reached the limit of operation.This reality is promoting the development of new thermal management solutions, including liquid cooling technology such as direct chip cooling and immersion cooling.Molex Mo Shizheng closely cooperated with customers, power ecosystem partners and OCP to accelerate the development of the next generation of cooling technology and standards.

3.         48 volt power system development momentum promotes the progress of car functions

By increasing the system voltage to 4 times, 48 volt technology can enhance the temperature pre -adjustment function of electric turbocharged, regenerative braking, entertainment system and auxiliary battery charging.In addition, larger current and higher voltage are essential for improving the power consumption efficiency of sensors, actuators and control units in the advanced driving assistance system (ADAS).

4.         The challenge of the power system is still one of the most difficult challenges in product design engineering.

The continuous demand for balanced power supply capacity, functional safety, efficiency and cost, and performance monitoring is promoting the industry's investment and innovation in battery technology and reduction of signal and power interference solutions.

5.         5G network deployment is progressing slowly and will continue to be blocked, because consumers expect the emergence of killer rating application software

The advent of Meta's Orion products indicates the future trend of AR glasses, but its promotion effect on 5G development will take time to appear.With the emergence of killer -level application software, the industry's demand for high -speed wireless connections and compact miniature connectors (such as Mo Shi Company provided by millions of micro -connectors provided by Mo Shi Company for top mobile equipment manufacturers) will accelerate 5G deploymentpace.

6.         The fusion of the solid and miniaturization of the connector will promote cross -industry innovation

The integration of the solidization and miniaturization of the connector will promote cross -industry innovation.The industry is using a compact and durable connector of 2.54 mm or smaller terminals. This trend will dominate the electric vehicle and partition architecture and achieve significant in the fields of consumer electronics, medical equipment, industrial automation and intelligent agriculture.progress.Combined with the advantages of miniaturization and solidification, it can improve spatial utilization, signal integrity and thermal management performance.

7.         improvement of material science will make product strength, weight and environmental performance balance

Digital twin, artificial intelligence and material database will play an increasingly important role in the fields of material characteristics recognition, processing innovation, selection, application engineering and testing.It is expected that more materials science will emerge in the construction of micro -connectors, especially in terms of balanced product strength, weight, conductivity, chemical tolerance, environmental protection performance, and the use of biomass materials.

8.         batch custom manufacturing and consumer -centric car experience varies from market

The development of vehicle architecture will be adjusted based on driving preferences and experiences around the world.In China, a dynamic market, continuous experiments will promote innovation; the European market represented by German auto manufacturers tends to adopt multiple technologies.American auto manufacturers will focus on software -driven architectures, especially in the field of passenger cars and sports multi -purpose cars.

9.         cross -industry cooperation will flourish, design engineers will learn from experience in different fields

As the design engineers use their professional knowledge in the large -scale data center to solve the problems of power and thermal management, sensor fusion and signal integrity in automotive and consumer electronics products, cross -industry cooperation is expected to accelerate.

10.         In order to cope with continuous supply chain fluctuations, the inventory re -balance and the flexibility of the supply of supply and supply need

Transform intelligence and data into practical resources, and obtain real -time insight in a faster and accurate way, thereby improving forecasting and risk management capabilities.This will promote the transformation of supply chain planning to a model -based and scenario -based model, and promote the decision -making process faster and more adaptable.