Yuancheng Suzhou Has The Mass Production Capacity Of Wafer High Stack Packaging (Involved HBM)

Future semiconductorOn the 9th, according to the survey, Jiang Bolongzi's company Yuancheng Suzhou has the mass production capacity of the wafer high -stack package (part of HBM technology).

Yuancheng Technology (Suzhou) Co., Ltd., formerly known as Suzhou,2023年被江龙波收买（以1.32亿美元收购了力成苏州70%的股权），具备先进晶圆级、FC、多层晶片叠封技术、FCCSP、铜柱凸点、BGA、QFN, SIP, and 16 layers of DIE technology and realizing high -end technology mass production such as 8D EUFS, but currently cannot produce HBM.Although HBM products are not directly designed, HBM needs high -end packaging manufacturing, which does not rule out that the company will carry out related business cooperation in the future.Yuancheng Suzhou reserves annual production capacity of 48 million universal flash storage (UFS) sealing and expansion projects, and has obtained mass production orders.The main customers come from SX, SK, XB, CJ, CX.

Licheng Suzhou used to be a semiconductor semiconductor seal and testing plant in China.More than 600 employees, more than 20 years of experience in sealing and mass production, are advanced sealing of 12 -inch wafer production technology and multi -layer chip sealing technology earlier in China.Installing enterprises, the chip packaging, testing and patch are the main business. The main products involve flash memory chips, memory chips and logic chips.Examination of production capacity550 million.

Jiang Bolong, a Chinese storage chip company, is a well -known domestic semiconductor storage company. It is committed to the development, production and sales of storage chipsAfter transfusion of Yuancheng Technology, from the past simple factories to semiconductor manufacturers with independent research and development, market and business expansion capabilities, exceptIn addition to meeting Jiang Bolong's sealing and testing needs, it will also independently undertake the sealing and testing business.Besides focusing onNAND FLASH and DRAM packaging tests are more committed to promoting the research and development of diversified products such as EMCP, EPOP, EMMC, UFS, BGA, etc., as well as the research and development of NMCARD, Micro SD storage, construction regulations, automotive storage and testing and testing.