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BOE Chen Yanshun: Breaking The Semiconductor Display Of The Semiconductor To Display The Growth Ceiling Through The "N -Curve" Strategy

existAt the BOE Global Innovation Partner Conference · 2024 (BOE IPC · 2024) held on September 4, Chen Yanshun, chairman of BOE Chen Yanshun Innovation Innovation, proposed the direction of the NN -curved dimension to enter the next new development stage for BOE.Regarding the future, Chen Yanshun said that through the Nip Nip strategy, BOE is expected to promote the global trillion -dollar market.

 

Looking for the future development of an enterpriseNip

In the process of deepening the semiconductor showed for more than 30 years, BOE has actually experienced many key choices. Each BOE can find a cracked method from it to allow the enterprise scale, ability and influence to reach a new level.This year is the 31st year established by BOE, and the BOE of the year of the year naturally thinks more about the future: what direction should BOE the next step in the next step?How to go?Chen Yanshun said in an interview with the reporter of the China Electronics News that what BOE is to do is to continue to find the NN curve of the future development of the enterprise.

 

So what isThe N curve promotion strategy?

 

Literally, it is mentioned that promotion is naturally a leap from one dimension to another, andThe N -strip curve is the support of another dimension.The Nigemon Rising Strategy is a key strategy of BOE from two -dimensional to three -dimensional, which will point out the direction for BOE to enter the next new development stage.

Chen Yanshun pointed out that BOE must break the growth ceiling of its own semiconductor display industry.What does the heat do, but starting from the core advantage of the enterprise itself, using the display technology as the original point, through the N -curve -dimensional dimension strategy, allowing the display technology to integrate more functions, derives more forms, and implant more scenarios.

 

Be optimisticAI, perovskite, photovoltaic and glass -based packaging

In an interview, Chen Yanshun explicitly pointed out, optimisticAI, perovskite ore photovoltaic and glass -based packaging and other innovative applications.

 

In fact, these three major applications are also trapped on the basis of BOE Semiconductor display business.The idea of BOE is that this can not only bring new ideas to the development of the enterprise, and it is not completely out of the core competitiveness of the enterprise, and the cost and error cost is relatively small.

 

Take the perovskite photovoltaic photovoltaic photovoltaic photovoltaic photovoltaic in the display panel.According to Chen Yanshun, there are many links in panel manufacturing and perovskite production technology.BOE, with its own mature production technology, technical experience, and equipment production lines, it can be developed and produced and produced and produced.

also,AI wave is redefining all walks of life.According to Chen Yanshun, BOE has begun to build core technical capabilities such as large model training, big data, and the Internet of Things with its deep IoT foundation and experience, and deeply integrates AI technology and industry to focus on AI+manufacturing, AI+products, AI+operations three three threeLarge areas.BOE will empower the semiconductor display and the Internet of Things business through AI to provide users with smarter, better and smarter products and services.

 

At the same time, the semiconductor display has always been the core business of BOE. The technological research and development of the past years has made it accumulate the three major advantages of semiconductor display technology, glass -based processing, and large -scale integration manufacturing. This has also provided a good foundation for glass -based packaging technologyEssence

 

existAt the BOE IPC 2024, BOE officially released and exhibited the glass base panel -level packaging board to semiconductor packaging to semiconductor packaging, becoming the first business department in mainland China to turn from display panels to advanced packaging.Chen Yanshun revealed that BOE has been prepared in terms of glass -based packaging technology, only to explode in market demand.

 

In the future, more will emergeThe N curve, I believe there is huge development opportunities in it.Chen Yanshun said that by 2030, BOE will release more than 500 cooperation topics, which will invest more than 100 billion yuan for technological research and development. The purchase amount of exceeding trillion yuan will promote industrial development and continue to stimulate industrial innovation vitality.

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