Explore The Application And The Current Status Of The Industry In Semiconductor Processing And The Current Status Of The Industry

With the continuous progress of science and technology, the semiconductor industry has become a key area for promoting global economic and technological development.Semiconductor devices are the core components of modern electronic products. From smartphones to supercomputers, they are inseparable from high sex.Energy semiconductor chip.However, as the size of the device becomes smaller and smaller and the processing accuracy requirements are getting higher and higher, traditional processing tools and methods can no longer meet the needs of modern semiconductor manufacturing.Due to its excellent physical characteristics, such as ultra -high hardness and thermal guidance, one by oneGradually become an important tool in semiconductor processing, especially in the processing link of high precision and high stability requirements.

Semiconductor processing is a complex multi -step process, including wafers manufacturing, lithography, etching, sedimentation, chemical mechanical polishing (CMP) and other links.Each link requires extremely high accuracy and cleanliness to ensure the function and reliability of the final chip.With the development of semiconductor technology, the size of the transistor is getting smaller and smaller, which puts higher requirements for the materials and techniques of processing tools.

Classified from the process, the front -end processing process of semiconductor materials mainly includes crystal rod tailoring, crystal rod rolling, crystal stick slice, wafer grinding, wafer chips and grinding edges, and wafers thinning and polishing; subsequent packaging processContains circuit production, polishing, back thinning, and slices. These processes are inseparable from the extensive use of diamond tools.

Crystal rod tailoring: After the straight pull method gets the crystal rod, according to the requirements of different products, use the electroplating tape or inner round cutting blade to cut it.Due to the low efficiency of internal or outer circular cutting, large material loss, and poor processing quality, the diamond zone is mostly used to cut the crystal rod.

Crystal rods are round: The surface of the crystal rod is not a regular cylindrical shape. Therefore, the electroplating or sintered diamond cup -shaped sand wheel needs to be used to round the crystal rod to achieve the required diameter.

Crystal stick slice: The method of crystal stick section mainly includes internal circular cutting and wire cutting.Compared with the internal circular cutting, the advantages of high -efficiency, large cutting diameter, and small saw marks loss of line cutting.At present, the silicon -based semiconductor mainly uses the abrasive wire saw cutting method. The steel wire with high -speed motion brings the abrasive into the cutting area to form tritermia grinding processing and cut the crystal rod into a silicon piece.

Walling chip grinding: The surface of the wafer may be damaged after the slice.In order to improve the quality of the wafer surface and remove the surface damage layer, the cup -shaped diamond sand wheel needs to be used for coarse and fine grinding of the silicon wafer.

Facking and grinding of wafer chips: The edges of the wafer cuts from the line may have burrs, edges, cracks, or other defects.By using the slot -shaped small sand wheel and the grinding grinding wheel to modify the sharp edge of the wafer as a curved, it can effectively reduce andAvoid the possibility of wafer collapse in subsequent processes.

Worse wafer thinning and polishing: The effective thickness of the circuit layer on the wafer is only5 ~ 10 μm, accounting for about 90%of the total thickness of the wafer.In order to ensure that the wafers have sufficient strength in the processing, testing and transfer of the wafer, while meeting the requirements of the wafer strength and thickness of downstream enterprises, the use of diamonds to reduce the thickness of the wafer to control the thickness of the wafer.

Polishing: In order to remove the damage layer caused by the above processes, and make efficient and high -quality polishing of hard ceramic matrix and soft metals, chemical mechanical polishing (CMP).During the polishing process, polishing pads will form a polishing layer, which seriously affects polishing efficiency and accuracy.Therefore, it is necessary to use King Kong Petrochemical Machinery Polishing Case to repair the whole pad to keep the flat surface and normal roughness of the plain pad.

Back loss: After the circuit is made, in order to promote the heat dissipation of the chip, extend the life of the chip and reduce the volume, the back of the back is needed to reduce the wafer chip.

Plan: In order to save costs and improve efficiency, companies usually make thousands of wafersIC chip array.First use the laser to pre -groan the wafer surface, and then use a scalpel to separate a single chip to facilitate the subsequent packaging process.The thinning of the wafer is a vital link in the entire processing process, and the requirements for diamond tools are extremely high.

      industry status quo

In recent years, the development of diamond tools and equipment for domestic semiconductor processing has made significant progress.In this field, domestic diamond tools have begun to show competitiveness in the market.Some domestic enterprises, such as Zhengzhou abrasive grinding utensil grinding institute Co., Ltd., Suzhou Saier Technology Co., Ltd., Shanghai Xinyang Semiconductor Materials Co., Ltd., Nanjing Sanchao New Materials Co., Ltd. and ZhengzhouQi Sheng Precision Manufacturing Co., Ltd., etc., their products can be comparable to imported products in terms of processing quality and efficiency, and at the same time provide competitive cost -effectiveness.

Especially Shanghai Xinyang Semiconductor Material Co., Ltd.The SYB series of diamond chip knives adopts advanced sedimentary technology and fine physical technologies to optimize and screen the size and appearance of diamond particles, and adjust the concentration, uniformity, and concentration of diamond on the blade. At the same time, at the same timeThe innovative process treatment of nickel -based binding agents has made products perform well in cutting accuracy, continuous cutting capacity and service life, and has a high cost performance compared to similar products from abroad.

Nanjing Sanchao New Materials Co., Ltd. focuses on the research and development, production and sales of diamond and cubic boron nitride tools. Its products are widely used in precision processing of hard and crisp materials, including semiconductor processing.

Although domestic diamond tools have achieved certain achievements in technological progress and market share, there is still a gap compared with international advanced levels.Especially in the processing needs of high -end products, the market share of domestic tools is relatively low, and high -end semiconductor processing companies are still inclined to use imported tools.This is mainly caused by factors such as technical barriers, insufficient innovation, and insufficient industrial upstream and downstream cooperation.

In the international market, JapanDisco is a global supplier of chip machine. Its thinner machine occupies a dominant position in the market and can be grinded for wafers with a thickness of less than 100 μm.DISCO's DF8540 thinner is favored by the market for its small quality, high reliability, and high accuracy.In addition, DISCO, Tokyo Precision Co., Ltd. and Israeli ADT (acquired by advanced microelectronics Co., Ltd.) are the three major suppliers of the global wafer cutting equipment. Their equipment has a significant influence in the mid -to -high -end market.

With the advancement of technology and market demand, domestic and foreign companies in the fields of wafer thinning and chipping equipment will be more intense, and they will also bring new opportunities and challenges to the development of semiconductor processing technology.

Looking forward to the future, with the continuous growth of China's semiconductor industry, the demand for diamond tools will also rise steadily.In order to reduce the difference from the international advanced levelFrom, Chinese enterprises need to increase investment in R & D and improve production technology, especially in the preparation of high -purity diamond materials and the manufacturing of ultra -high -precision tools.At the same time, government and industry organizations should also strengthen support for this field and promote technological innovation and international cooperation.

In the international market, with the development of semiconductor technology and the increase in demand, the scope of application of diamond tools will be further expanded.In the future, high -performance diamond tools will not only be used for traditional semiconductor processing, but also in emerging fields, such as quantum computing, quantum computing, quantum computing,5G communication and artificial intelligence chips play an important role in manufacturing.This trend will provide more development opportunities for Chinese companies, but it will also bring greater challenges.