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A Must-See For Industrial Control!Fujie FRP Resistors Cope With Extreme Environments With A Wide Temperature Range Of - 55℃~155℃Source: Release Date:2025/11/12 Click On:12
In the current wave of accelerating digital transformation and the booming development of cutting-edge industries such as 5G communications and new energy vehicles, electronic components are the foundation of the industr...
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Precise Flow Control + Automatic Recovery: Technical Analysis Of Atlink's Resettable Fuse Circuit SolutionSource: Release Date:2025/11/5 Click On:13
Fuse Elements - Theoretical OverviewThe technology of polymer positive temperature coefficient (PPTC) materials and components is a process engineering that integrates advanced polymer material science, conductive materi...
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New Rules Of American AI Export Control: Opposing Under Waves Or "Self -Eating Bad Results"Source:ijiwei Release Date:2025/1/15 Click On:2072
The first artificial intelligence export control rules in the United States finally unveiled the veil.1moon13On the day, the Bayeng government issued an artificial intelligence (AI) The temporary final rules of the sprea...
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3 Household Appliances Drive/Electric Control Enterprise Performance Revival: Materius 2.3 Billion Yuan!Source: Release Date:2024/9/5 Click On:28
Recently, domesticThree companies related to new energy vehicle electric drives and electrical control issued the first half of the 2024 transcript, revealing its latest performance and car business progress:○ Great Ocea...
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Research On The Body (District) Domain Control: Cost Reduction Weapon For Vehicles, Large Hardware Integration+Software SOASource: Release Date:2024/8/2 Click On:20
Integrated is the most important means of reducing the cost of the vehicle. The functional integration of the body domain has been widely used. TraditionalBCM, Seat,PEPS、TPMSFunction boxes, gateway and other functions wi...
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The Latest Industrial Control Chip Supplier Spot Delivery Period And Price TrendSource: Release Date:2023/6/13 Click On:2547
According to the latest observations, from the beginning of 2023, the industry growth rate from heaven to purgatory. Perhaps, for industrial control chip manufacturers, a new round of shuffle has just begun?Inventory: TI...
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The Competition Of Large Models Heating Up, And The Control Of AI Chip Control Is Difficult To Limit DevelopmentSource: Release Date:2023/4/18 Click On:2436
The Institute of International Strategy (IISS) of the well -known research institutions released a report recently, pointing out that although the United States restricts high -performance AI chips exporting to China, th...
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Dafang Has Acquired 60% Stake In Shitong Metal Co-operation Electric Bicycle And Electronic Control Components BusinessSource:爱集微 Release Date:2019/2/20 Click On:4783
Dafang, an electronic component factory owned by Mingji Youda Group, announced on the 20th that it would cooperate with Tongtong Metal Co., Ltd. in strategy and acquire a 60% stake in Shitong Metal for NT$720 million. Da...
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Shanghai Broadcom Integrated Ipo: R & D Costs Increase Year By Year, Real Control Is Us Citizenship.Source:laoyaoba.com Release Date:2018/5/22 Click On:3895
China Network Finance and Finance (May 21st) Limited by Share Ltd (Shanghai) Limited by Share Ltd (hereinafter referred to as "Bo Tong integration") recently disclosed a prospectus on the SFC's website. The company plans to issue 34 million 678 thousand and 400 shares in the Shanghai Stock Exchange and 139 million shares after the issuance of the total equity. The sponsor is CITIC Certificate (19.810, 0.08, 0.41%).
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Kla-tencor Introduces Five Development Control Systems For The Manufacture Of Ics Below 7 NanometersSource:KLA-Tencor Release Date:2017/9/18 Click On:4571
KLA-Tencor today introduced five development control systems for logic and cutting-edge memory design nodes below 7 nm to help wafer manufacturers achieve the rigorous process tolerances required for multiple exposure techniques and EUV lithography. At the IC manufacturing facility, the ATL stacking measurement system and the SpectraFilmF1 thin film measurement system provide process characterization analysis and offset monitoring for the fabrication of finFET, DRAM, 3D NAND and other complex component structures.
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