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The Silicon Labs Radio Product Family Addresses The Growing Cost-effectiveness Challenge In The Automotive IndustrySource:Silicon Labs Release Date:2017/8/10 Click On:4530
Silicon Labs (also known as "Core Technology") has launched the industry's most scalable, flexible and cost-effective car radio solution for the global automotive infotainment market.
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Linghua Technology Announces 4k H.265 Image Application For High-level Media Cloud ServerSource:Linghua Technology Release Date:2017/8/10 Click On:3367
ADLINK is committed to promoting cross-industry data decision-making applications, as the world's leading provider of edge computing solutions, today announced the new media cloud server MCS-2080, a dedicated high-density platform, in 2U space can support Up to 16 Intel Xeon E3-1585 v5 processors.
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Vishay Introduced The Industry's First Mlcc For High Frequency Rf And Microwave ApplicationsSource:Vishay Release Date:2017/8/8 Click On:4594
Vishay Intertechnology, Inc. today announced the industry's first surface-mount multilayer ceramic chip capacitors (MLCC) for high frequency RF and microwave applications - the VitramonVJ HIFREQ HT series with operating temperature range of +200 ° C
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Renesas Electronics R-car Series Soc Supports The Automotive Linux PlatformSource:Renesas Electronics Release Date:2017/8/8 Click On:3958
Raisar Electronics, Inc., the world's leading provider of semiconductor solutions, today announced that it has begun massaging its first R-Car system-on-chip (SoC) system using automotive-grade Linux (AGL) software.
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Linear Technology 4 Output Monolithic Synchronous Step-down Converter Lt8602Source:Linear Technology Release Date:2017/8/7 Click On:3643
Advanced Driver Assistance Systems (ADAS) helps to drive safely and alerts the driver when the system detects a risk from the surrounding object, no matter what the risk is. Increasing the ADAS system is one of the major trends in the car from 2016 to 2020.
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Gloriafeld Launches 7-nanometer Special Application Integrated Circuit Platform For Data Center, Machine Learning And 5g NetworkSource:GLOBALFOUNDRIES Release Date:2017/6/19 Click On:5310
GLOBALFOUNDRIES announces the introduction of its FX-7 ™ ASIC (Application Specific Integrated Circuits) using a 7nm FinFET process. The FX-7 is an integrated design platform that combines state-of-the-art process technology with differentiated intellectual property rights and 2.5D / 3D packaging technology to deliver the industry's most complete portfolio of data centers, machine learning, automotive, wireline communications and 5G wireless applications s solution.
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Maxim Introduces Automotive Led Control For External Lighting And Improved Safety Applications With Fast Response Time And Low EmiSource:Maxim Release Date:2017/6/19 Click On:4988
Maxim announced the MAX20078 Synchronous Buck, High Brightness LED Controller, the industry's only component that provides both fast response time and low EMI (EMI) for external LED lighting and improved safety applications. The LED controller can be used for matrix lighting design, providing designers with high-performance, simple design, and can quickly market solutions.
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On Semiconductor Improves Imaging Performance For High-resolution Industrial ApplicationsSource:ON Semiconductor Release Date:2017/6/15 Click On:4734
ON Semiconductor's KAI-29052 is available in a CPGA-72 package that conforms to the Restriction of Hazardous Substances Directive (RoHS), with black and white, Bayer and Sparse Color configurations, and with the existing KAI-29050 image sensor and a full range of 5.5 Micron and 7.4 micron CCD image sensor are fully pin compatible, enabling camera manufacturers to quickly adopt new components.
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Toshiba Introduces Low Current Consumption For Low Current Consumption And Enhanced Safety CommunicationsSource:Toshiba Release Date:2017/6/15 Click On:4941
Toshiba Semiconductor and Storage Products announced two new "TC3567CFSG" and "TC3567DFSG" leading industry [1] to achieve lower current consumption than the plateau [2] and enhance the safety communication function. These two ICs are Toshiba's latest members of Bluetooth-enabled low power (LE) [3] ver.4.2 communication chips. The sample is available.
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Investment 35 Billion Yuan Wuhan Huaxing Photoelectric 6th Generation Flexible Ltps-amoled Production Line StartedSource:CSOT Release Date:2017/6/14 Click On:4214
On the morning of June 13, the total investment of 35 billion yuan Wuhan Huaxing photoelectric 6th generation flexible LTPS-AMOLED production line (Huaxing photoelectric t4 project), in the optical Valley intelligent manufacturing industry park started.
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