2.5D And 3D Packaging Technology: An Important Means To Improve The Performance, Integration And Energy Efficiency Of AI Chip

AI(AI) The rapid development of technology puts forward extremely high requirements for computing power, which directly promotes the innovation of chip design and manufacturing. Among them, the evolution of chip packaging technology is particularly critical.In this background,2.5Dand3DAs a representative of advanced packaging technology, packaging technology has gradually become improvedAIThe important means of chip performance, integration and energy efficiency.

2.5DEncapsulate

2.5DPackaging technology is a transition form between traditional two -dimensional flat packaging and three -dimensional three -dimensional packaging.It passes through the intermediary (Interposer) This key component realizes high -speed interconnection between chips.The intermediary layer is usually made of silicon, glass or organic material. It is covered with tiny convex points or perforated, which can connect multiple chips.These chips are not directly stacked, but are placed side by side on the intermediary layer.HDI) Technical implementation of data exchange between each other.This layout reduces the distance between the signal transmission between the chip, increases the data transmission speed, and reduces delay and power consumption. It is very suitable for high -performance interconnectionAIapplication.

3DEncapsulate

3DThe packaging technology goes further, stacking multiple chips together directly, and passingTSVsWaiting for vertical interconnection technology to achieveAD8403AR10Direct communication between chips.This stacking design greatly shortens the distance between the signal transmission between the chip, thereby reducing the delay and increasing the data transmission rate, which is very suitable for the required high calculation density and the energy efficiency ratioAIapplication.3DPackaging technology makes it possible to integrate more computing units in a very small space, and it is particularly important for real -time processing of complex algorithms such as deep learning and image recognition.

Chiplettechnology

Chiplet(Small chip) is a kind of2.5D/3DInnovative design ideas that are closely related to packaging technology, it allows a complex system -level chip (SoC) Decomposition into multiple function modules (that ischiplets), Each module can be made on different process nodes, and then integrated through advanced packaging technology.This method can not only flexibly select the semiconductor technology that is best for each module, but also reduce design and production costs, and speed up the time of product marketing.forAIIn terms of chip,ChipletTechnology helps to optimize the hardware architecture of specific computing tasks, such as efficiently integrating calculation units, memory, andI/OInterface to achieve optimal performance and energy efficiency balance.

AIThe chip adopts an example of advanced packaging technology

numerousAIChip manufacturers have begun to adopt these advanced packaging technologies to enhance their product competitiveness.For example:

1、AMD:ThatRadeon Instinct MI250X GPUAdopted2.5DPackaging technology, useInfinity Fabric LinkInterconnected technology, realized through the intermediary layerGPUThe high -speed communication between the betweenAICalculating efficiency and performance.

2、Intel:releaseFoveros 3DPackaging technology, first applied toIntel LakefieldIn the processor, by stackingCPUCore, graphic engine, memory and otherI/OComponents realize a more compact design and higher energy efficiency ratio.forAIaccelerator,IntelPlan to use3DPackaging technology to integrate different functional modules to optimize performance and power consumption.

3、TSMC（TSMC) He Sun and Moonlight (ASE): As the world's leading chip foundry and packaging test service provider, they are manyAIChip company provided2.5Dand3DThe package solution supports various application scenarios from high -performance calculation to edge computing.

4, Huawei: Although facing the supply chain challenge, in its Kirin seriesSoCIn China, Hisilicon has also explored a higher integration packaging technology, such as using advanced packaging technology to integrateCPU、GPU、NPUWait for a variety of functional modules to enhanceAITreatment ability and overall system performance.

These examples are only the tip of the iceberg, withAIThe continuous expansion of applications and the continuous growth of computing power demand,2.5D、3DEncapsulation andChipletTechnology has become a pushAIThe key factor of chip performance jumped, they not only solve the integration and interconnection of traditional packaging technology, but alsoAIThe innovation of hardware provides strong technical support. It is the futureAIchipImportant trend of development.